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Printed s.r.o.: Českolipská 1449, Mělník, Tel.: +420 315 670 137, Fax: +420 315 671 495, E-mail: printed@printed.cz
Products > Four-layer-pcbs

4-layer PCBs:

  • Assembly: Core made of 1 mm-FR4, on both sides copper plated  18/18 µm or  35/35 µm. Inner layers IN1 and IN2 are etched. Then both sides are laminated with prepreg  20 µm and with copper foils 18/18 µm or 35/35 µm. Afterwards the top and bottom layers are placed. Resulting board  thickness is 1.5 mm.
  • Different thicknesses of the core and prepreg can be ordered. To achieve proper impedance of the circuit, copper to copper distances can be held in tolerance of 10 µm.
  • Drilling according to the drilling data, holes metallized. Blind- or inside-vias can be ordered.
  • Solder mask, photolitografically transfered
  • Service print
  • Tinned with Cn100C HAL /not recommended/, or
  • Galvanic gold over galvanic nickel, or
  • treated with OSP

Maximum size:

380 x 400mm in galvanic tin

300 x 400mm solder mask and HAL /not recommended/

300 x 400mm galvanic gilded

300 x 400mm OSP

Needed documents:

  • GERBER data with control prints.Layer order must be clearly marked and described fom TOP to BOT in order not to be interchanged.
  • Positive films with tracks, solder masks and service print. Set of data files always required for production purpses.
  • EXCELLON drill data. Blind- or inside-vias must be included in separate drill data files. with the information of which layers it concerns.
  • Final board size, eventual milling drawing. The final dimensions are finished only by milling. Other wishes have to be consulted during placing the order.
  • All multilayer boards are tested: inner layers are optically tested, final boards are electrically tested. This testing is included in the board price.